Collaborative Initiatives

Secondary Projects & Collaborations

Apart from my main Ph.D. dissertation thrusts, I actively collaborate on experimental setups, analytical modeling, and materials characterization with colleagues and research peers at UTARI.

Mechanical Fixture ASTM D6641

Design of Combined Load Compression Fixture for Composites

Collaboration with IPPM Group

Engineered and fabricated a standardized Combined Load Compression (CLC) test fixture strictly meeting ASTM D6641 standards. The fixture ensures pure in-plane compression testing of high-modulus composite coupons by eliminating specimen buckling and eccentricity issues.

Tools: SolidWorks CAD • Precision Tooling • CNC Machining • MTS Alignment
Thermal & Polymer Chemistry Prepreg Aging

Cure Kinetics Study of E-Glass Fiber Prepregs

Work with Monjur Morshed Rabby

Investigated the degradation of out-of-life and room-temperature-aged carbon-fiber and E-glass/epoxy prepregs. Utilized Differential Scanning Calorimetry (DSC) and Broadband Dielectric Spectroscopy (BbDS) to discover empirical cure-kinetics relationships and predict final manufactured mechanical properties.

Published in: SAMPE • Technical Proceedings
In-Situ Sensing Fatigue SHM

Dielectric Spectroscopy to Monitor Stiffness Degradation

Work with Dr. Muthu Ram Prabhu Elenchezhian

Proposed a dielectric characterization methodology for in-situ monitoring of composites under dynamic fatigue environments. Introduced a novel measuring technique using Extremely Conductive Silver Epoxy Adhesive (ECSEA) paste to identify early precursors of irreversible structural damage.

Published in: Elsevier Composite Structures (IF: 5.14)
Electronics Packaging Thermal Interface

Characterization of Thermal Interface Materials (TIM)

Collaboration on Electronics Packaging

Comparative thermal aging analysis between silicone-based and silicone-free thermal gap filler materials used in high-power electronic packages. Characterized mechanical, thermal, and dielectric degradation using DMA, TMA, DSC, FTIR, and BbDS.

Published in: MDPI Materials (IF: 3.06)